This product can be applied to diamond pulley in cutting process.
Dicing saw巨片-荧光陶瓷片
MDS-68A巨片-荧光陶瓷片
| Equipment | Model No. | MDS-68A Wafer Dicing Saws |
| Size | 1500mm(L)*1800mm(W)*1750mm(H) | |
| Weight | 2000kg (约) | |
| Diamond Wire | Wire Speed | 2000 meter/min. (max.) |
| Wire Storage/Length | 8~20km (* Diameter various) | |
| Tension | 5~20N | |
| Diameter | 0.08~0.15mm | |
| Dicing Parameter | Cutting mode | Forward/Backward |
| Thickness of workpiece | 0.1mm (min.) ~ 10mm (max.) | |
| Size of workpiece | 1 ~ 203.2mm (8" wafer) | |
| CCD alignment accuracy | ±0.01mm | |
| Rotary accuracy | ±0.01mm | |
| Facility | Electric Power | 220V, 50/60HZ, Ф3Phase |
| CDA | 0.4-0.6Mpa | |
| Air consumption | 100Liter/min (约) | |
| Coolant | 纯水/水，依切割质量耗水量调整 |