This product can be applied to truncate large, irregularly-shaped, hard and brittle materials such as silicon crystal, quartz, ceramics, sapphire, glass, gallium arsenide, and so on.
• The PLC program control can accurately master the cutting processes • Reciprocal wire travel direction, optional modular sawing parameters • Adjustable high wire-speed design • Combining with MDWEC Diamond-Coated Wire can shorten the cutting time by 50%, lower cost and enhance the productivity • Suitable for slicing brittle & hard materials, the versatile working-platform design can be applied to a wide range of workpiece cutting • The low kerf-loss reduces lapping & polishing time for the next stage and the waste of manpower and consumable • The user-friendly computer-interfaced system is easy to operate and maintain, long consumable life, simple consumable replacement, and easy to acquire spare parts
Specification |
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| Item (Model No.) | AnyCut (uAWS-1500 ) | |||||||||||
| Workpiece dimension | Max. 500*500*300 mm | |||||||||||
| Wire running speed | Max. 600 m/min | |||||||||||
| Wire guide | Ø170 mm | |||||||||||
| Number of wire guides | 5 sets | |||||||||||
| Rocking degree | 0 ~ +/-7 | |||||||||||
| Z Table stroke | 600 mm | |||||||||||
| Z In feed rate | 0.01 ~ 150 mm/min | |||||||||||
| Wire diameter | Ø 0.15 ~ 0.35 mm | |||||||||||
| Wire Tension | Max. 40 N or less | |||||||||||
| Volume of the tank | 200 L | |||||||||||
| Installation dimension | W2000 X D2300 X H2300 mm | |||||||||||
| Machine weight | 3500 KG | |||||||||||