With our successful development experience in "single & multi-wire machine" and "the actual cutting process applications", MDWEC developed the Anycut Wire Saws Machine to meet the customer's requirements of different workpiece sizes in cutting and cropping process; especially for mono/polycrystalline silicon and sapphire ingots cutting process. Combining with MDWEC Diamond-Coated Saw Wire can fully enhance the work completion and high productivity.
This product can be applied to truncate large, irregularly-shaped, hard and brittle materials such as silicon crystal, quartz, ceramics, sapphire, glass, gallium arsenide, and so on.
• The PLC program control can accurately master the cutting processes • Reciprocal wire travel direction, optional modular sawing parameters • Adjustable high wire-speed design • Combining with MDWEC Diamond-Coated Wire can shorten the cutting time by 50%, lower cost and enhance the productivity • Suitable for slicing brittle & hard materials, the versatile working-platform design can be applied to a wide range of workpiece cutting • The low kerf-loss reduces lapping & polishing time for the next stage and the waste of manpower and consumable • The user-friendly computer-interfaced system is easy to operate and maintain, long consumable life, simple consumable replacement, and easy to acquire spare parts
|Item (Model No.)||AnyCut (uAWS-1500 )|
|Workpiece dimension||Max. 500*500*300 mm|
|Wire running speed||Max. 600 m/min|
|Wire guide||Ø170 mm|
|Number of wire guides||5 sets|
|Rocking degree||0 ~ +/-7|
|Z Table stroke||600 mm|
|Z In feed rate||0.01 ~ 150 mm/min|
|Wire diameter||Ø 0.15 ~ 0.35 mm|
|Wire Tension||Max. 40 N or less|
|Volume of the tank||200 L|
|Installation dimension||W2000 X D2300 X H2300 mm|
|Machine weight||3500 KG|