Development of the Dicing Saw (MDS-68A) and obtaining a Taiwan utility model patent while applying for patents in Japan and South Korea.

Development of multi-category brittle material cutting equipment and outsourcing services, including fluorescent sheets, silicon carbide, silicon, quartz, AlSiC, germanium (Ge), and engineering plastics.

Developed Sapphire Touch Screen, Diamond Grinding Rods, Silicon Carbide (SiC) Cutting, Grinding, Polishing Process and Supplies and Large Single Crystal Diamond

Successfully Registered ISO-9001 Certification

Developed AnyCut Multi-function of Diamond Wire Saws for Squaring (AnyCut®)

Developed EasyCut Multi-wire of Diamond Wire Saws for Slicing

Developed New Process for High Effective Electroplated (EP) Diamond Coating Wire (Improving Quality and Service Life)

Developed New Process for High Effective Resins (RB) Diamond Coating Wire (Improving Quality and Reducing the Wire Consumption of 4 meter/wafer)

Established the Advanced Instrumental Analysis Center and Combined the Academic Resources (Universities and Research Institutes) for Co-operations and Exchange

Developed PV Wafer Separator

Developed Single Wire Saws Equipment.

Developed Fix Abrasives for PV Wafering Process

Developed Wire Saws Coolant (Dia.-Coolant)

Developed Wire saws Roller & Roller guides (Dia.-Pulley)

Developed G-Power (Solid/Liquid Separator)

Developed Gigabond Epoxy Adhesives (AB-Glue)

Developed Multi-Wire Saws Equipment

Developed & Massively Produce Diamond Wires

Became The 4th in The World, The 1st In Taiwan and China to Massively Produce Diamond Wires

Developed Multi-Wire Saws Machine

Developed Sapphire Substrate Process, Equipment and Consumable

Established Micron Diamond Wire & Equipment Co., Ltd. (MDWEC)

Developed Free Abrasive Material (Silicon Carbide) for Wire Saw and Recycling System

Developed Diamond Coated Wire of Electro Plated & Resin Bonded, Wire Saw Equipment, and So On