This product can be applied to truncate large, irregularly-shaped, hard and brittle materials such as silicon crystal, quartz, ceramics, sapphire, glass, gallium arsenide, and so on.
• Single diamond wire saws design, reciprocal wire travel direction, PLC program control • High wire-speed design; combining with MDWEC Diamond-Coated Wire can shorten the cutting time by 50%, lower cost and enhance the productivity • Rocking options are available for improving excellent surface completion and thickness control • Suitable for slicing brittle & hard materials, the versatile working-platform design can be applied to a wide range of workpiece cutting • The low kerf-loss reduces lapping & polishing time for the next stage and the waste of manpower and consumable • The user-friendly computer-interfaced system is easy to operate and maintain, long consumable life, simple consumable replacement, and easy to acquire spare parts
Specification |
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| Item (Model No.) | uSWS-1700L | |||
| Workpiece dimension | Max. 600 (H) X 600 (W) X 400 (D) | |||
| Wire running speed | Max. 800 m/min | |||
| Wire guide | Ø163 mm | |||
| Number of wire guides | 6 sets | |||
| Rocking degree | 0 ~ +/-3 | |||
| Z Table stroke | 780 mm | |||
| Z In feed rate | 0.01 ~ 150 mm/min | |||
| Wire diameter | Ø 0.15 ~ 0.35 mm | |||
| Wire Tension | Max. 60 N or less | |||
| Volume of the tank | 100 L | |||
| Installation dimension | 2620 (H) X 1700 (W) X 1050 (D) | |||
| Machine weight | 2500 KG | |||