This product can be applied to hard and brittle materials such as sapphire, silicon carbide (SiC), gallium nitride (GaN), etc.
• T-8331A is applied to cut up to φ6-inch and 300mm length ingots • Double productivity (φ4-inch only needs 6 hours)） • High-precision processing of TTV 10μm and Bow 10μm • Low running cost and wire consumption (15m/wafer for φ4-inch sapphire ingot) • The rocking column mechanism holds the wire guides is more effective for cutting hard and brittle materials • Excellent rigid structure keeps the rocking column mechanism more stable • Twist-free wire management system can maintain the wire torque, skewing balance and the wire tension control when the wire is under the high-speed operation • High-speed and accurate process enable to assure the 1,200mm/min. of high wire speed and 1.5 sec. of high-speed reciprocating acceleration/deceleration cutting cycle under the heavy-loaded tension • The integrated cutting position can be set by different work conditions, such as wire speed, rocking speed, angle, etc
Specification |
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| Item (Model No.) | uSWS-1700L | |||||||||||
| Workpiece dimension | Max. 600 (H) X 600 (W) X 400 (D) | |||||||||||
| Wire running speed | Max. 1200 m/min | |||||||||||
| Wire guide | Ø170 mm | |||||||||||
| Number of wire guides | Single Wire | |||||||||||
| Rocking degree | ± 3 | |||||||||||
| Z Table stroke | 600 mm | |||||||||||
| Z In feed rate | 0.01 ~ 150 mm/min | |||||||||||
| Wire diameter | Ø 0.15 ~ 0.42 mm | |||||||||||
| Wire Tension | Max. 60 N or less | |||||||||||
| Volume of the tank | 200 L | |||||||||||
| Installation dimension | W2387 X D2330 X H1412 mm | |||||||||||
| Machine weight | 2800 KG | |||||||||||