KLDJ70Y-Ring Wire Cutting M/C

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  • KLDJ70Y-Ring Wire Cutting M/C

单刃式线切割割设备,适合单/多晶硅晶棒及蓝宝石晶棒截断头尾及特殊用途的截面加工

Application

This model is suitable for cutting medium and large materials, using bus absolute value,no need to return to the mechanical or origin when starting up,smooth wire transportation, small wire bow,saving time and effort.


Characteristics

• KLDJ70Y-Ring Wire Cutting M/C design, reciprocal wire travel direction, PLC program control
• High wire-speed design; combining with MDWEC Diamond-Coated Wire can shorten the cutting time by 50%, lower cost and enhance the productivity
• Rocking options are available for improving excellent surface completion and thickness control
• Suitable for slicing brittle & hard materials, the versatile working-platform design can be applied to a wide range of workpiece cutting
• The low kerf-loss reduces lapping & polishing time for the next stage and the waste of manpower and consumable
• The user-friendly computer-interfaced system is easy to operate and maintain, long consumable life, simple consumable replacement, and easy to acquire spare parts

Detailed Description

KLDJ70Y
Worktable Size 800×800 mm
Linear Axis Stroke X750×Y700 mm
Maximum Product Size 700×700×300mm
Worktable Load Capacity 300Kg
Maximum Linear Velocity 2000 m/min
Processing Efficiency 0.1~1000 mm/min
Diameter of Abrasive Ring Φ0.35~0.8 mm
Positioning Accuracy 士0.01 mm
Processing Accuracy ≤0.2 mm
Surface Roughness of Processed Surface Ra ≤ 1.25
Length of Abrasive Wire  4330 mm
Main Drive Wheel Diameter Φ260 mm
Secondary Drive Wheel Diameter Φ260 mm(3PCS)
Maximum Cylinder Thrust 377 N
Screen Size 19 ″
Equipment Power 5 Kw
Air Source Pressure 0.6~0.8 MPa
Operating Voltage 380V 50Hz 士10%
Ambient Temperature 10℃~30℃
Equipment Weight 2000 Kg
Equipment Body Dimensions 2370×1680×1900 mm