This model is suitable for cutting single pieces of material. When combined with the rotating worktable,it can perform synchronous rotaing cutting and the slice thickness is adjustable, saving time and effort.
• NLDJ20SQ-Ring Wire Cutting saws design, reciprocal wire travel direction, PLC program control • High wire-speed design; combining with MDWEC Diamond-Coated Wire can shorten the cutting time by 50%, lower cost and enhance the productivity • Rocking options are available for improving excellent surface completion and thickness control • Suitable for slicing brittle & hard materials, the versatile working-platform design can be applied to a wide range of workpiece cutting • The low kerf-loss reduces lapping & polishing time for the next stage and the waste of manpower and consumable • The user-friendly computer-interfaced system is easy to operate and maintain, long consumable life, simple consumable replacement, and easy to acquire spare parts
Detailed Description |
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KLDJ20SQ |
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Worktable Size |
200×280 mm |
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Linear Axis Stroke |
Y250×Z250 mm |
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Maximum Product Size |
200×250×230 mm |
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Worktable Load Capacity |
50Kg |
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Maximum Worktable Speed |
- |
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Maximum Linear Velocity |
2000 m/min |
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Processing Efficiency |
0.1～1000 mm/min |
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Diameter of Diamond Abrasive Ring |
Φ0.35～0.8 mm |
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Positioning Accuracy |
士0.01 mm |
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Processing Accuracy |
≤0.03 mm |
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Surface Roughness of Processed Surface |
Ra ≤ 1.25 |
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Length of Diamond Abrasive Wire |
1790 mm |
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Main Drive Wheel Diameter |
Φ260 mm |
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Secondary Drive Wheel Diameter |
Φ180 mm(2PCS) |
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Maximum Cylinder Thrust |
377 N |
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Touch Screen Size |
7 ″ |
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Equipment Power |
4 Kw |
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Air Source Pressure |
0.6～0.8 MPa |
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Operating Voltage |
220V 50Hz 士10% |
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Ambient Temperature |
10℃～30℃ |
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Equipment Weight |
400 Kg |
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Main Equipment Size |
1000×800×1850 mm |
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