KLDJ160Q-Ring Wire Cutting M/C

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  • KLDJ160Q-Ring Wire Cutting M/C

单刃式线切割割设备,适合单/多晶硅晶棒及蓝宝石晶棒截断头尾及特殊用途的截面加工

Application

This model is suitable for cutting medium and large materials, using bus absolute value,no need to return to the mechanical or origin when starting up,smooth wire transportation, small wire bow,saving time and effort.


Characteristics

• KLDJ160Q-Ring Wire Cutting design, reciprocal wire travel direction, PLC program control
• High wire-speed design; combining with MDWEC Diamond-Coated Wire can shorten the cutting time by 50%, lower cost and enhance the productivity
• Rocking options are available for improving excellent surface completion and thickness control
• Suitable for slicing brittle & hard materials, the versatile working-platform design can be applied to a wide range of workpiece cutting
• The low kerf-loss reduces lapping & polishing time for the next stage and the waste of manpower and consumable
• The user-friendly computer-interfaced system is easy to operate and maintain, long consumable life, simple consumable replacement, and easy to acquire spare parts

Detailed Description

KLDJ160Q

Worktable Size

Φ1400 mm

Linear Axis Stroke

Y900×Z600 mm

Maximum Product Size

Φ1600×600 mm

Worktable Load Capacity

3000Kg

Maximum Worktable Speed

20 RPM

Maximum Linear Velocity

2700 m/min

Processing Efficiency

0.1~1000 mm/min

Silicon Carbide Ring Diameter

Φ0.35~0.8 mm

Positioning Accuracy

士0.01 mm

Processing Accuracy

≤0.2 mm

Surface Roughness of Processed Surface

Ra ≤ 1.25

Silicon Carbide Wire Length

 6380 mm

Main Drive Wheel Diameter

Φ350 mm

Secondary Drive Wheel Diameter

Φ260 mm(3PCS)

Maximum Cylinder Thrust

377 N

Touch Screen Size

7 ″

Equipment Power

6.5 Kw

Air Source Pressure

0.6~0.8 MPa

Operating Voltage

220V 50Hz 士10%

Ambient Temperature

10℃~30℃

Equipment Weight

3000 Kg

Equipment Body Dimensions

2300×3200×2100 mm