KLDJ15SQ-Ring Wire Cutting M/C

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  • KLDJ15SQ-Ring Wire Cutting M/C

环型线切割割设备,适合单/多晶硅晶棒及蓝宝石晶棒截断头尾及特殊用途的截面加工

Application

This model is suitable for cutting small-sized materials, can perform irregular cutting has small edge breakage, low noise, low power consumption.


Characteristics

• KLDJ15SQ-Ring Wire Cutting M/C design, reciprocal wire travel direction, PLC program control
• High wire-speed design; combining with MDWEC Diamond-Coated Wire can shorten the cutting time by 50%, lower cost and enhance the productivity
• Rocking options are available for improving excellent surface completion and thickness control
• Suitable for slicing brittle & hard materials, the versatile working-platform design can be applied to a wide range of workpiece cutting
• The low kerf-loss reduces lapping & polishing time for the next stage and the waste of manpower and consumable
• The user-friendly computer-interfaced system is easy to operate and maintain, long consumable life, simple consumable replacement, and easy to acquire spare parts

Detailed Description

KLDJ15SQ
Worktable size 200×150 mm
Linear axis stroke X180×Y100 mm
Maximum product size 150×180×100 mm
Worktable load capacity 15Kg
Maximum linear velocity 2500 m/min
Processing efficiency 0.1~1000 mm/min
Diameter of abrasive ring Φ0.35~0.8 mm
Positioning accuracy 士0.01 mm
Processing accuracy ≤0.03 mm
Surface roughness of processed surface Ra ≤ 1.25
Length of abrasive wire  1210 mm
Diameter of main guide wheel Φ180 mm
Diameter of auxiliary guide wheel Φ180 mm
Maximum thrust of cylinder 500 N
Screen size 7″
Equipment power 1.5 Kw
Operating voltage 220V 50Hz 士10%
Ambient temperature 10℃~30℃
Equipment weight 100 Kg
Main body dimensions of the equipment 640×560×1560 mm